Material: FR4
Board Thickness: 0.53+/-0.1mm
Copper Thickness: Inner layer 17um,External layer 17um
Soldermask Color: Green
Silkscreen Color: White
Surface Technics: ENIG
6 Layer Blind Via PCB,The Min Holes:0.2mm, Min Line width and space:3mil/3mil.BGA 0.5mm,Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6
programmed digital automatic control
Product Description
Material: FR4
Board Thickness: 0.53+/-0.1mm
Copper Thickness: Inner layer 17um,External layer 17um
Soldermask Color: Green
Silkscreen Color: White
Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)
Min Holes:0.2mm
Min Line width and space:3mil/3mil
BGA 0.5mm
Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6
HDI PCB stack up
HDI PCB Manufacturing Process
HDI PCB FAQ
Q : How long does the mass production time of HDI PCB design and manufacture?
A : It is about 10 - 15 working days after confirming of PCB Gerber File.
Q : What color is the solder mask of my HDI PCB design?
A : It is black,of course,you can choose another color in your HDI PCB Board.
Q : What kind of surface technics do you use in high density interconnect pcb ?
A : It usually uses ENIG.
Q : How many layers can you produce of high speed pcb design?
A : We can produce multilayer HDI printed circuit boards about 4-30 layers.
The detailed information, please see “WHAT PROCESS CAPABILITY CAN WE MAKE FOR HDI PCB”
Picture Of Details