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High TG  PCB


Material: FR4 TG 170 or TG180 (Shengyi)

Board Thickness: 1.6mm

Copper Thickness: 1/1/1/1/1/1/1/1

Soldermask Color: Green

Silkscreen Color: White

Surface Technics: ENIG (1-3u")

Min Holes: 0.2mm

Min Line space and width: 4/4mil


FR4 TG170 material,can make TG180,Shengyi Grade A material

the commonly PP thickness:









Computer,communication equipment,precise apparatus and instrument,router and etc.

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  • Details

Multilayer High TG  PCB

Product Description

Material: FR4 TG 170 or TG180 (Shengyi)
Board Thickness: 1.6mm
Copper Thickness: 1/1/1/1/1/1/1/1
Soldermask Color: Green  
Silkscreen Color: White
Surface Technics: ENIG (1-3u")
Min Holes:0.2mm
Min Line space and width: 4/4mil

FR4 TG Made Ability

 NO  Item Craft Ability

Surface Finishh

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2 Layer 2-30 layers
3 Min. Line Width 3 mil
4 Min. Line  Space
3 mil
5 Min. Space between Pad to Pad 3 mil
6 Min.Hole Diameter 0.10 mm
7 Min. Bonding Pad Diameter 10 mil
8 Max. Proportion of Drilling Hole and Board Thickness 1:12:5
9 Max. Size of Finish Board 23 inch*35 inch
10 Rang of Finish Board's Thickness 0.21-7.0 mm
11 Min. Thickness of Soldermask 10 um
12 Soldermask Green,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask
13 Min. Linewidth of Idents 4 mil
14 Min. Height of Idents 25 mil
15 Color of Silk-screen White,Yellow,Black
16 Date File Format Gerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++
17 E-testing 100% E-Testing:High Voltage Testing
18 Material for PCB

High TG Material:High Frequence

(ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material 

19 Other Test Impedance Testing,Resistance Testing,Microsection etc
20 Special Technological Requirement
Blind&Buried Vias and High Thickness Copper

8Layer Multi-layer circuit board structure

Inner Layer Core thickness:0.2MM
Finished board thickness:1.5±0.1MM
          _____________________  H   (Copper)
             _______________     2116*2(4.6mil*2) (PP)
             _______________     7628M*1(7.5mil) (PP)
             _______________     7628M*1(7.5mil) (PP)
             _______________     2116*2(4.6mil*2) (PP)
          _____________________  H   (Copper)

PCB tg Quality Requirement

1.on-time delivery:≥97% 
2.double layer board acceptability≥99% 
3.four-layer board acceptability:≥98% 
4.six-layer board acceptability:≥97% 
5.eight-layer board acceptability:≥97% 
6.ten-layer board acceptability:≥95% 
7.customer satisfaction :≥90% 
8.complaint rate/rejected rate:≤ 3%

High TG FR4 PCB Certificates

UL, TS16949, ISO14001, ISO9001-2008, and RoHS

Multilayer High TG PCB FAQ

Q: What is the MOQ?

A: The minimum order quantity of high temperature pcb material  is 5pcs.

Q: What the package of the high temp fr4 pcb products?

A: We use vacuum packaging.

Q: Do you accept PCB design with different TG boards on the same panel?

A: Of course, we can do different boards on the same panel.

Q: What kind of surface treatment process do you adopt on my multi layer high TG PCB boards?

A: Such as ENIG, Plating Gold, HAL-LF, Chem.Tin, Chem.Ag and OSP

Q: How to get the PCB?

A: For small production, we will ship the boards to you by DHL, UPS, or EMS. Door to door service. You can get your PCBs at home.For heavy goods more than 300kg, Shipped by Sea or By Air, you can saving freight cost.Of course, if you have your own forwarder, we may contact them to deal with your shipment.

Q:How long does it take to deliver my 8-layer high TG pcb circuit board?

A: 8-layer pcb board sample delivery time is 120 hours,and the mass production lead time is 10 days

Picture Of Details


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