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Multilayer PCB Design PCB Copy And PCB Assembly Reverse Engineering China

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Multilayer PCB Design PCB Copy And PCB Assembly Reverse Engineering China

Parameter

Base Material : FR4,FR1,CEM3

Copper Thickness : 0.5oz-4oz

Board Thickness : 0.2mm - 4mm

Layer : 1-24layers

Finish Hole Size : PTH +/-0.003'' ,NPTH +/-0.002"

Certificate : ISO 9001:2000;ISO 14001;ISO/TS16949:2002 ,UL E203640

Technology

Is derived according to the customer provides, the example of reverse or PCB Gerber file, BOM file

Applications

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  • Details

PCBA Technical Parameters


No. Items Capacity
1 Max.Assembly PCB Panel Size 250mm*300mm
2 Min. Component Package 0402, 0201(accept less than 4pcs)
3 Min. Assembly PCB Thickness 0.2mm
4 Min. BGA Assembly Distance 0.3mm(BGA edge to edge)
5 PCB Assembly Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA
6 Type of assembly SMD&DIP
7 Solder Type Water Soluble Solder Paste Leaded and Lead-Free
8 File Format Bill of Materials; Gerber files; Pick-N-Place file
9 Types of Service Turn-key partial turn-key or consignment
10 Component Package Cut Tape Tube Reels Loose Parts
11 Tesing Flying Probe Test; X-ray Inspection; AOI Test
12 Quantity MOQ 1PCS to Mass Production
生产流程


Our production capacity 

1. Assembly Capabilities

  • Printed Circuit Board Assembly (PCBA)
  • Through Hole
  • Surface Mount (SMT)
  • PCB Handling up to 400mm x 500mm
  • RoHS Compliance Production
  • Non RoHS Production – where permitted
  • AOI

2. OEM/ODM/EMS Services for PCB Assembly:

  • PCBA, PCB ASSEMBLY: SMT&PTH&BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT)
  • Custom clearance for material improting and product exporting

3. PCBA Capacity:

  • SMT: 2,000,000 solder joints per day
  • DIP: 300,000 joints per day
  • Certifications: ISO 9001