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Aluminum PCB process capability

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Aluminum PCB process capability

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  • Details

NO

Item

Capability

1

Product Type

Al Clad PCB 1 layer

2

Maximum Panel size

1470mm*600mm

3

Copper thickness

0.5oz, 1oz, 2oz, 3oz

4

Dielectric Thickness(to Substrate)

0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm

5

Substrate Core Thickness

0.4mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm,3.0mm,3.2mm

6

Finished Board Thickness

0.4mm To 4.0mm

7

Thickness Tolerance

+/- 10%

8

Aluminum Machining

Drilling,Tapping,Milling, Routing, Die-Punching,break-off tab available

9

Min. Finish hole size

0.25mm

10

Max. working voltage

2.5k VDC(0.075mm Dielectric) 3.75k VDC(0.15mm Dielectric)

11

Min. Track Width

0.2mm (8mils)

12

Min. Track gap

0.2mm (8mils)

13

Min. SMD pad pitch

0.2mm (8mils)

14

Surface Finishing

HASL, HASLLeadfree, Immersion gold, OSP

15

Solder mask color

White, LED light special White, Black, MATT Black, others Available

16

Legend color

Black, White, others Available

17

E-test

YES

18

Rosh

YES

19

Reference Standard

IPC-A-600G Class 2

20

Special holes

Spot facing, Cup holes

21

Data Input

Gerbers, AutoCad, Cam350,

PROTEL99SE,PROTEL,DXP,POWER PCB.

Aluminum PCB Flow Chart
Material
Purchasing
IQC Cutting CNC 
Drilling
IPQC Image Transfer pertreatment
IPQC Etching IPQC Developing Exposure IPQC
Solder Mask
Dretreatment
IPQC Solder Mask
Printing
Solder Mask
Baking
Solder Mask
Exposure
Solder Mask
Develop
IPQC Surface
Treatment
Legend
Curing
IPQC Legend
 Printing
IPQC
Pouting V-cut Clear ET-TEST Final Packing
8 IPQC(InPut Process Quality Control),guarantee product quality 、safty and reliety