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Rigid PCB Aluminum PCB Flexible PCB PCB Assembly Manufacturing capacity

Flexible PCB process capability

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Flexible PCB process capability

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Flexible   Capability

No Item Technical data
 1 Flexible layers 1~8layer
 2 Minimum Trace and Space 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm
 3 Minimum Space Betw  en

Coverlay Openings

 

0.2mm

 4 Edge of Coverlay 

Opening to Trace

 

0.20mm(preferred)

 5 Minimum Space between

coverlay and solder pad

0.15mm
 6 Polyimide Films 0.5 mil (12.5), 1 mil (25), 2 mils (50), 3 mils (75),

4mils(100), 5 mils(125) as custmer requested

 7 Thermobond Adhesives Acrylic/Modified Acrylic, Modified Epoxy, Polyimide
 8 Copper Foils (RA or ED) 1/3oz (12), 1/2oz (18), 1oz (35), 2oz (70)
 9 Stiffeners Polyimide, rigid FR4, PSA, metal, or customer

supplied&requested

 10 FR-4 in Multi-layer Flex

Circuits

Laminated to flex circuit to create rigid flex boards,

typically with vias.

 11  

Surface Finish

Electroless Ni/Au, Electrolytic soft/hard gold,

Tin plating,,Imm.Tin,Entek/OSP

 12 Solder Resists Coverlay, Photo-Imagable Resist
 13 Hole tolerance ±0.05mm
 14 Smallest Drill Size 0.2mm
 15 Largest Drill Size 6.35mm
 16 Smallest Slot Width 0.35mm
 17 Min.space between holes 0.15mm
 18 Minimum conductor edge to

outline edge

0.1mm
 19 Minimum space between

coverlay and conductor

±  0.15mm
 20 Hole to outline edge

≥  0.10mm

21    Tooling tolerances Knife(Soft) tooling : ±  0.25mm
Steel(Hard) tooling : ±  0.05mm
CNC drill/rout : ±  0.10mm
 22

Maximum Layer to Layer 

Mis-registration

±  0.10mm
 23  Copper Plated Thickness(PTH only)  8~15um;20~30um;30~70um(special)
24

Au thickness

Electroless Ni/Au   Ni:2~6um;Au:0.035~0.075um

Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um