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Fr-4 Rigid PCB process capability

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Fr-4 Rigid PCB process capability

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  • Details
NO Item Craft Ability
1 Surface Finish HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2 Layer 1-30 layers
3 Min.Line Width 3mil
4 Min.Line Space 3mil
5 Min.Space between Pad to Pad 3mil
6 Min.Hole Diameter 0.10mm
7 Min.Bonding Pad Diameter 10mil
8 Max.Proportion of Drilling Hole and Board Thickness 1:12:05
9 Max.Size of Finish Board 23inch*35inch
10 Rang of Finish Board′s Thickness 0.21-7.0mm
11 Min.Thickness of Soldermask 10um
12 Soldermask Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
13 Min.Linewidth of Idents 4mil
14 Min.Height of Idents 25mil
15 Color of Silk-screen White,Yellow,Black
16 Date File Format Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
17 E-testing 100%E-Test:High Voltage Testing
18 Material for PCB High TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material
19 Other Test Impedance Testing,Resisitance Testing,Microsection etc
20 Special Technological Requirement Blind&Buried Vias and High Thickness Copper