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Blind Via PCB

Parameter

Material: FR4

Board Thickness: 0.53+/-0.1mm

Copper Thickness: Inner layer 17um,External layer 17um

Soldermask Color: Green

Silkscreen Color: White

Surface Technics: ENIG

Technology

6 Layer Blind Via PCB,The Min Holes:0.2mm, Min Line width and space:3mil/3mil.BGA 0.5mm,Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6

Applications

programmed digital automatic control 

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  • Details

6Layer Blind Via PCB HDI PCB Design

Product Description


Material: FR4

Board Thickness: 0.53+/-0.1mm

Copper Thickness: Inner layer 17um,External layer 17um

Soldermask Color: Green

Silkscreen Color: White

Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)

Min Holes:0.2mm

Min Line width and space:3mil/3mil

BGA 0.5mm

Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6


PCBQUICK-Blind Via PCB 4


HDI PCB stack up


HDI PCB stackup


HDI PCB Manufacturing Process


HDI PCB manufacturing process


HDI PCB FAQ



Q : How long does the mass production time of HDI PCB design and manufacture?

A : It is about 10 - 15 working days after confirming of PCB Gerber File.


Q : What color is the solder mask of my HDI PCB design?

A : It is black,of course,you can choose another color in your HDI PCB Board.


Q : What kind of surface technics do you use in high density interconnect pcb  ?

A : It  usually uses ENIG.


Q : How many layers can you produce of high speed pcb design?

A : We can produce multilayer HDI printed circuit boards about 4-30 layers.


 The detailed information, please see “WHAT PROCESS CAPABILITY CAN WE MAKE FOR HDI PCB


Picture Of Details


PCBQUICK-Blind Via PCB 1


PCBQUICK-Blind Via PCB 2


PCBQUICK-Blind Via PCB 3